Location<\/strong><\/td>\n| Rest of UK<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n This is a hands-on process engineering opportunity in County Durham, supporting the scale-up of advanced RF assembly technology for a long-established client in the high-frequency electronics sector. The position focuses on taking new microwave, millimetre-wave, RF, and semiconductor assembly processes from development into dependable, repeatable manufacturing. It is aimed at someone who enjoys practical engineering work in a high-precision production setting and wants to have a direct impact on how new technologies are introduced and improved.<\/p>\n What you will do<\/h3>\n\n- Develop, optimise, and control manufacturing processes used in RF and semiconductor module production.<\/li>\n
- Support the transition of advanced assembly technologies from development into stable, scalable manufacturing.<\/li>\n
- Work on die attach process development, with particular attention to silver epoxy, silver sinter, and eutectic attach methods.<\/li>\n
- Contribute to wire bonding activities, including gold wire and ribbon bonding across a variety of substrates and device materials.<\/li>\n
- Collaborate closely with RF engineering, quality, operations, and manufacturing colleagues to ensure new technologies are transferred successfully into production.<\/li>\n
- Improve process robustness, production yield, manufacturability, and cost efficiency.<\/li>\n
- Support new product introduction work and contribute to future technology roadmap activity.<\/li>\n
- Investigate and resolve process issues such as voiding, bond line thickness variation, shear strength problems, bond integrity concerns, thermal resistance issues, and pad damage.<\/li>\n
- Take part in process validation and qualification activities, including the creation and upkeep of control plans, standard operating procedures, and other manufacturing documentation.<\/li>\n
- Apply structured problem-solving methods to identify root causes and implement effective improvements.<\/li>\n<\/ul>\n
What the client is looking for<\/h3>\n\n- Experience working as a Process Engineer in semiconductor, RF module assembly, microelectronics, power electronics, hybrid assembly, advanced packaging, or another precision electronics manufacturing environment.<\/li>\n
- Practical experience with one or more die attach processes, such as silver epoxy, silver sintering, or eutectic attach.<\/li>\n
- Exposure to wire bonding techniques such as gold wire bonding, ribbon bonding, ball bonding, or wedge bonding.<\/li>\n
- Good understanding of process windows and how variables such as temperature, pressure, time, and atmosphere affect yield and reliability.<\/li>\n
- Experience with process validation, qualification planning, control plans, SOPs, or similar manufacturing documentation.<\/li>\n
- Ability to investigate technical issues involving voiding, bond line thickness, shear strength, bond integrity, thermal resistance, or pad damage.<\/li>\n
- Knowledge of yield improvement methods, root cause analysis, and structured problem-solving approaches such as 8D, DMAIC, or FMEA.<\/li>\n
- A degree, or equivalent experience, in engineering, materials science, physics, or a related technical discipline.<\/li>\n
- Additional experience with RF packaging requirements, SPC, Cp\/Cpk, JEDEC standards, equipment commissioning, automation, or material reliability testing would be advantageous, though it is not required.<\/li>\n
- The role is particularly suitable for someone who prefers a practical, hands-on process engineering position rather than a job that is mainly documentation-led.<\/li>\n<\/ul>\n
Why this opportunity stands out<\/h3>\n\n- The client is investing heavily in advanced packaging and assembly capability.<\/li>\n
- The Process Engineer will play an important role in bringing new RF technologies into reliable, scalable production.<\/li>\n
- You will work closely with both development and manufacturing teams.<\/li>\n
- The role offers genuine influence over how processes are designed, validated, and improved.<\/li>\n
- This is a strong opportunity for someone who wants to contribute to the growth of next-generation RF assembly capability.<\/li>\n<\/ul>\n
How to apply<\/h3>\nFor further information, candidates are invited to contact Teddy Jones at IC Resources. The posting also includes an Apply Now option.<\/p>\n\n Degree Requirement:<\/strong> Not Specified<\/p>\nVisa Sponsorship May be<\/strong><\/p>\n","protected":false},"author":1,"featured_media":0,"template":"","meta":{"_acf_changed":false,"om_disable_all_campaigns":false,"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0,"_promoted":"","_job_location":"Rest of UK","_application":"https:\/\/ic-resources.com\/en\/jobs\/process-engineer-461456\/","_company_name":"IC Resources Recruitment","_company_website":"","_company_tagline":"","_company_twitter":"","_company_video":"","_filled":0,"_featured":0,"_remote_position":0,"_job_salary":"","_job_salary_currency":"GBP","_job_salary_unit":"yearly"},"job-types":[],"class_list":["post-2183","job_listing","type-job_listing","status-publish"],"acf":[],"jetpack_sharing_enabled":true,"jetpack_likes_enabled":true,"_links":{"self":[{"href":"https:\/\/coderseditor.com\/itjobs\/wp-json\/wp\/v2\/job-listings\/2183","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/coderseditor.com\/itjobs\/wp-json\/wp\/v2\/job-listings"}],"about":[{"href":"https:\/\/coderseditor.com\/itjobs\/wp-json\/wp\/v2\/types\/job_listing"}],"author":[{"embeddable":true,"href":"https:\/\/coderseditor.com\/itjobs\/wp-json\/wp\/v2\/users\/1"}],"wp:attachment":[{"href":"https:\/\/coderseditor.com\/itjobs\/wp-json\/wp\/v2\/media?parent=2183"}],"wp:term":[{"taxonomy":"job_listing_type","embeddable":true,"href":"https:\/\/coderseditor.com\/itjobs\/wp-json\/wp\/v2\/job-types?post=2183"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}} |