Process Engineer

Process Engineer Overview

This is a hands-on process engineering opportunity in County Durham, supporting the scale-up of advanced RF assembly technology for a long-established client in the high-frequency electronics sector. The position focuses on taking new microwave, millimetre-wave, RF, and semiconductor assembly processes from development into dependable, repeatable manufacturing. It is aimed at someone who enjoys practical engineering work in a high-precision production setting and wants to have a direct impact on how new technologies are introduced and improved.

What you will do

• Develop, optimise, and control manufacturing processes used in RF and semiconductor module production.
• Support the transition of advanced assembly technologies from development into stable, scalable manufacturing.
• Work on die attach process development, with particular attention to silver epoxy, silver sinter, and eutectic attach methods.
• Contribute to wire bonding activities, including gold wire and ribbon bonding across a variety of substrates and device materials.
• Collaborate closely with RF engineering, quality, operations, and manufacturing colleagues to ensure new technologies are transferred successfully into production.
• Improve process robustness, production yield, manufacturability, and cost efficiency.
• Support new product introduction work and contribute to future technology roadmap activity.
• Investigate and resolve process issues such as voiding, bond line thickness variation, shear strength problems, bond integrity concerns, thermal resistance issues, and pad damage.
• Take part in process validation and qualification activities, including the creation and upkeep of control plans, standard operating procedures, and other manufacturing documentation.
• Apply structured problem-solving methods to identify root causes and implement effective improvements.

What the client is looking for

• Experience working as a Process Engineer in semiconductor, RF module assembly, microelectronics, power electronics, hybrid assembly, advanced packaging, or another precision electronics manufacturing environment.
• Practical experience with one or more die attach processes, such as silver epoxy, silver sintering, or eutectic attach.
• Exposure to wire bonding techniques such as gold wire bonding, ribbon bonding, ball bonding, or wedge bonding.
• Good understanding of process windows and how variables such as temperature, pressure, time, and atmosphere affect yield and reliability.
• Experience with process validation, qualification planning, control plans, SOPs, or similar manufacturing documentation.
• Ability to investigate technical issues involving voiding, bond line thickness, shear strength, bond integrity, thermal resistance, or pad damage.
• Knowledge of yield improvement methods, root cause analysis, and structured problem-solving approaches such as 8D, DMAIC, or FMEA.
• A degree, or equivalent experience, in engineering, materials science, physics, or a related technical discipline.
• Additional experience with RF packaging requirements, SPC, Cp/Cpk, JEDEC standards, equipment commissioning, automation, or material reliability testing would be advantageous, though it is not required.
• The role is particularly suitable for someone who prefers a practical, hands-on process engineering position rather than a job that is mainly documentation-led.

Why this opportunity stands out

• The client is investing heavily in advanced packaging and assembly capability.
• The Process Engineer will play an important role in bringing new RF technologies into reliable, scalable production.
• You will work closely with both development and manufacturing teams.
• The role offers genuine influence over how processes are designed, validated, and improved.
• This is a strong opportunity for someone who wants to contribute to the growth of next-generation RF assembly capability.

How to apply

For further information, candidates are invited to contact Teddy Jones at IC Resources. The posting also includes an Apply Now option.

Degree Requirement: Not Specified

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